Photo Lithography Process Tools
MSX 3000 (Lithography & Wet Process Tools)
- Automated system up to 300mm
- Spin Coating
- Spin Developing
- Baking
- Spin Flux Cleaner
- SECS/GEM
- Dimensions (mm) : 2300(W) X 3000(D) X 1950(H)
- Provide customized spec
MSX 1000
- Automated system up to 300mm
- Spin Coating
- Spin Developing
- Baking
- Spin Flux Cleaner
- SECS/GEM
- Dimensions (mm) : 2300(W) X 3000(D) X 1950(H)
- Provide customized spec
MSX 2000
- Automated system up to 300mm
- Spin Coating
- Spin Developing
- Baking
- Spin Flux Cleaner
- SECS/GEM
- Dimensions (mm) : 2300(W) X 3000(D) X 1950(H)
- Provide customized spec
Wet Process Tools
Metal Lift-Off Neo
- Automated system up to 200mm
- Spin Lift-Off, P.R Stripper, P.R Cleaner
- Soaking
- SECS/GEM
- Dimensions (mm) : 2090(W) X 3220(D) X 2200(H)
- Provide customized spec
SSP 200 (Wet Process & Other Tools)
- Manual system up to 300mm
- Spin Etcher
- Semi Automated system up to 200mm
- Spin Coating & Vacuum Chamber Dry
- SECS/GEM
- Dimensions (mm) : 1580(W) X 1370(D) X 2400(H)
- Provide customized spec
Electro Plating Process Tools
JIKJI-77
- Automated system up to 300mm
- Material : Cu, Ni, Sn, SnAg, SnAu
- eG1 / eG2 / Pre-Wet / CG / Act / Anneal / AuSn
- SECS/GEM
- Dimensions (mm) : 2016(W) X 5222(D) X 2605(H)
- Provide customized spec
TSV Single System
- Manual system up to 300mm
- Material : Cu, Ni, Sn, SnAg, SnAu
- eG1 / eG2 / Pre-Wet / CG / Act / Anneal / AuSn
- SECS/GEM
- Dimensions (mm) : 1160(W) X 745(D) X 1800(H)
- Provide customized spec
Single Plating
- Manual system up to 300mm
- Material : Cu, Ni, Sn, SnAg, SnAu
- SECS/GEM
- Dimensions (mm) : 1160(W) X 745(D) X 1800(H)
- Provide customized spec
Other Tools
SSP 300
- Automated system up to 200mm Ring frame
- Spin Protective Coating
- SECS/GEM
- Dimensions (mm) : 1600(W) X 1143(D) X 2000(H)
- Provide customized spec
TLX 500
- Automated system up to 370mm X 470mm
- Spin Coating
- Spin Developing
- Baking
- SECS/GEM
- Dimensions (mm) : 4190(W) X 3500(D) X 2000(H)
- Provide customized spec